solutions

solutions

Collaboration work with Moldex3D

 

Intro:
CoreTech System Co., Ltd. (Moldex3D) was founded in 1995, it provides the world leading CAE software – “Moldex3D” for the design and manufacture of plastic injection molds. The key to Moldex3D’s success is the innovation of true 3D analysis technology in providing “as good as real” simulation solutions. With that most advanced technology, Moldex3D has helped lots of manufacturers to in-depth simulate the widest application range of injection molding processes to optimize product design and manufacturability, shorten time-to-market, and save millions of dollars every year.

Parallel Computing:
Moldex3D provides high-performance Parallel Computing capabilities for plastic injection molding design and optimization to help customers troubleshooting from product design to development, optimizing mold configuration, reducing time to market, and maximizing return on investment.
We are the ONLY one to offer the entire Parallel Computing support in Flow, Pack, Cool, Warp, Fiber, MCM, and so on. Even more, Moldex3D’s Parallel Computing technology supports Multi-CPU, Multi-Core and PC-Cluster platforms.

This turnkey solution combines Moldex3D’s Parallel Computing technology with PC-Cluster, making it a powerful tool that would significantly increase the whole analysis speed.

Benchmark data

 

Software Information:
Moldex3D/Solid-Flow R9.1 enhanced version

Hardware Information:
Node Specification

  • Processor: Dual-Core Intel® Xeon® Processor E3110 @ 3.0Ghz
  • Chipset: Intel® X38 + ICH9-R
  • Memory: Four DDR2-667/800 ECC (Total: 8GB)
  • HDD: SATA 3.0Gb/s 250GB
  • I/O: Two external USB 2.0 ports
  • Two 10 / 100 / 1000 Base-TX RJ45
  • One COM DB9 port
  • One VGA port
  • Expansion: PCI Express x16 full height card
  • PSU: 370W

System Specification              

  • Node: Quantity: 4
  • HUB: 8 ports Gigabit Switching HUB
  • OS: Microsoft® Windows® XP 64bit
  • Size: H 23.1” x W17.1” x D25.2” (H 586mm x W 434mm x D 640mm)
  • Weight: 91lbs / 41kg
  • Noise Level: 41.4 dB(A)
  • Power Consumption: 630W (with Core™2 Duo E6850, 4GB RAM, Full load)
  • Operating Environment: 100 - 120 V / 50 ~ 60 Hz, 50 to 95 F (10 to 35 C), 20 to 80% (RH), non condensing

For further information regarding to the software, please contact Moldex3D's sales team.
For any of hardware questions or quotation request, please contact us.